1. Web-based architecture, allowing multiple users to log in remotely through the domain
2. Integrate and store a large amount of defect data and images detected by AOI equipment, which can be used for production history statistical analysis, real-time monitoring of online AOI equipment defect detection status, defect photo viewing, product defect Map overlay and defect type judgment Code and other functions
3. Can be combined with AI for big data analysis and feedback to production equipment to issue warnings for production anomalies

1. Line Scan high-speed detection + AI defect classification
2. Support for front and back side appearance defect detection of Silicon/Glass Wafer
3. Applicable to CIS/IQC/OQC
4. Can be equipped with “8/12” EFEM, supports SECS GEM200/300

1. High-speed automatic defect photography based on KLARF file for分区/分Die/Defect size/Defect type
2. Provides AI real-time defect detection; instant detection and classification, processing speed up to 50 FPS or more
3. Can be equipped with “8/12” EFEM, supports SECS GEM200/300
4. Defect photography and detection of wafer/packaging process QA inspection stations/CP & FT

1. AI real-time defect detection and classification, real-time detection and classification, processing speed can reach more than 50 FPS
2. Can be equipped with “8/12” EFEM, supports SECS GEM200/300
3. Min defect size ≧ 0.3µm
4. Can be equipped with a yield management system

1. Resolution and defect detection capability range can reach 1.5um~5um
2. Zero dead angle detection area, can achieve 100% full panel coverage
3. Excellent autonomous image detection technology can support all sizes and different touch image designs
4. Intelligent defect classification function
5. Provide professional and customized services

1. Resolution and defect detection capability range can reach 3um~5um
2. Detection area can cover both the mask area and the frame area at the same time
3. Inspection technology can support mask products with different image designs and any shape
4. Intelligent defect classification function

1. Real-time autofocus
2. Real-time image stabilization function
3. Smart measurement function
4. Comprehensive observation of bright field and DIC
5. Ultra-long depth of field synthesis function
6. Ultra-large range puzzle
7. Image target navigation
8. AI defect target detection
9. 3D profile measurement

1. AI real-time detection; detection calculation speed can reach up to 50 FPS or more
2. Detection items: copper pad defects, offset, LED bonding abnormalities (chip position displacement/rotation)
3. Can support different sizes of substrates/panels according to customer needs

1. Ultra-high-speed AI real-time detection
2. Detection items: Chip defects, damage, dirt, scratches, missing chips
3. Post-mass transfer chip position displacement/rotation measurement
4. Can support “4~8" wafers and different sizes of panels according to customer needs

1. High-speed detection + AI defect classification
2. Detection items: Open/short circuits, foreign objects, dirt, scratches in the display area and peripheral Fan-Out area
3. Can support different sizes of substrates/panels according to customer needs

1. AI real-time detection on the production line, fast, accurate and time-saving
2. Chips in the tray can be detected for misplacement/tilting/dropping/stacking

1. Can provide images of different magnifications
2. Composite camera head design (supports 1-4 Review Head groups)
3. Can correspond to defect data produced by different AOI equipment
4. Intelligent defect classification function

1. Unique AI real-time measurement and inspection solution
2. Can correspond to “8/12” Wafer/Frame form
3. Chip reset position offset/rotation measurement
4. Can support Bumping damage/Die chipping detection at the same time

1. Eliminate non-layer circuit pattern interference; effectively detect current layer circuit defects
2. Applicable to 4 Layer RDL fine line L/S=2µm line products
3. Die to Die & Die to CAD

1. AI real-time detection; detection calculation speed can reach up to 50 FPS or more
2. Open/Short/Dent defect detection
3. Effectively avoid copper particles/discoloration/foreign object false positives
4. Provide SAP/mSAP process pre-etching and etching electroplated copper lines

Adopting X/Y gantry moving platform, it can be individually or integrated with color/film thickness/OD spectrometer measurement modules, applied to the automatic precision measurement of color/film thickness/OD unevenness and abnormality after each coating process

1. Resolution and defect detection capability range can reach 3um~10um
2. Can support LTPS products, and can support peripheral line inspection for COA products
3. Area inspection, and also supports BM area inspection function
4. Excellent autonomous image detection technology can support all sizes, different image designs and any shape of panel products
5. Intelligent defect classification function

1. Resolution and defect detection capability range can reach 10um~100um
2. Can support pre-cut panel size, post-cut “12~75” panel size and shaped products
3. Detection area can cover both the inner area and the glass cutting edge at the same time
4. Defect classification function

Adopting high-precision optical imaging measurement modules and combining special platform and light source design can provide high-precision CD/Overlay measurement

1. AI real-time defect detection; high-speed photography, instant inspection and classification
2. Automatic linewidth/aperture measurement

AI defect classification and judgment solutions can be provided according to the needs of different customers in the production and manufacturing process

1. Resolution and defect detection capability range can reach 1um~5um
2. Can support substrate sizes from G3.5 to G10.5
3. Zero dead angle detection area, can achieve 100% full panel coverage
4. Excellent autonomous image detection technology can support all sizes, different image designs and any shape of panel products
5. Intelligent defect classification function
6. Provide professional and customized services

1. AI real-time defect detection; high-speed photography, instant inspection and classification
2. Automatic linewidth/aperture measurement