Ultra Ability Application

Solutions：

result(s)

Die Bond / Wire Bond multi-layer Chip stacking measurement and inspection can be used, and the AI inspection system can be used to improve the detection accuracy rate to 99.99%
Distance: arc height, gap between arcs, line spacing, etc., any measurement of plane or step distance
Abnormality: Wire deviation, ball drop, broken wire and other appearance defects

Software / Hardware

Image recognition rate > 95%
Model adjustment
Intelligent classification
Can detect pores, holes, notches, cracks, micro-cracks, material surface indentation, dirt, scratches, foreign body adhesion, material deformation

Software / Hardware

Applicable products: G+G, TP+LCM
Detection resolution: 10μm
Detection accuracy: 30μm or above in length or width
Inspection items: internal bubbles, foreign objects, bonding accuracy
Special function: can be used for product stratification to detect only internal defects
The machine software establishes a basic AOI framework, which can plan for the machine to learn the software by itself. The client can establish the defect code by itself, so that the machine can deeply identify and learn, so as to achieve the final intelligent judgment and classification inspection machine.

Software / Hardware

Detect aperture size according to customer requirements, detection accuracy: 1μm
Surface appearance defects: foreign objects, opening and closing, bumps, rust, breaks, opening and closing shielding, etc.

Software / Hardware

5-8inch≤12S，1-12inch≤20S，12.1-17inch≤35S
False detection rate ≤ 3%, missed detection rate ≤ 0 PPM, to meet customer's outgoing quality control rate
Use advanced algorithms to stably detect ITO micro scratches
Can generate daily production inspection details and has MES upload function for convenient product information query

Software / Hardware

Regarding cell slicing cross-section measurement, cameras are set up on both sides of the roller conveyor. When the conveyor clamps are positioned, images are simultaneously captured. The images will then be measured, and the measurement information will be stored in the designated format in the inspection computer.
Hardware modification scope: The imaging module is fixed on the positioning slide and moves synchronously with it, so that no adjustment of the imaging module is required after changing the product size.
Measurement range: The vertical surface of the cut cross-section is photographed, and the blade groove depth is measured within the imaging range.

Software / Hardware

Prediction accuracy > 95%
False positive rate < 5%
Detect 100 images within 60 seconds (including download, preprocessing, prediction and upload)

Software

Company Description