Cognex's Deep Learning defect detection tools can find unacceptable and varied coating defects on wafer surfaces, which would be too complex or time-consuming for rule-based machine vision systems. The tool inspects the wafer surface, detecting if any cracks, chips or stains are present across it. It is trained on many different images showing variations in defect types and locations to identify potential areas of interest for inspection. Cognex's Deep Learning classification tools then classify the defects (e.g. cracks, chips, particles, etc.). This information can be used to improve processes to reduce defects and increase yield.