Since die bonding technology is the key to the packaging process, it has high requirements for speed and accuracy. However, the texture of the process image is very complex. Traditional optical inspection cannot use logic writing to detect defects such as angle, displacement deviation and missing, which often leads to missed detection, misjudgment and wrong positioning, which greatly affects the production efficiency of the packaging line.Using the Solomon SolVision AI image platform to enhance the reliability of displacement and angle information, accurately detect the manufacturing errors and abnormal conditions of the die bonding system. On the other hand, the AI module can also extend the learning of different chip forms and perform analysis and detection for different types of packaging products.