Wafer cutting is a very important process in the semiconductor and optoelectronics industries. If the cutting process cannot maintain high yield, high efficiency and maintain chip characteristics, it will greatly affect the overall production capacity. The quality control of the wafer cutting saw is mainly through the detection of external defects. Common external defects include irregular patterns and multiple drills on the saw body. Since the wafer cutting saw itself has circular stripes, it forms a complex image background, which seriously affects the machine vision for defect detection.Using the Feature Detection tool of SolVision AI image platform, the irregular patterns and multiple drill defects in the image samples are annotated and trained to train the AI model. AI vision can then detect various defects on the wafer cutting saw body in real time.