The situation of chip jumping in the wafer is random, and the resulting defect patterns are diverse and difficult to predict the location of the defects. For AOI, it is almost impossible to set logic for jump defects and detect them based on it.Using the Segmentation technology of SolVision AI image platform, the AI model is trained with image samples of defects such as stacking, missing materials, skewing and misplacement, and flipping. After the AI training is completed, it can easily and quickly identify and mark the positions of abnormal pick and place on the wafer.